Radiation detecting apparatus and  radiation detecting system

ABSTRACT

To reduce peeling between members constituting an radiation detecting apparatus, the radiation detecting apparatus of the present invention includes a laminating layered structure in which a supporting substance, an adhesive layer, an array substrate having a photoelectric conversion element, a scintillator layer for converting a radiation into light and a resin layer are stacked in this order. Of arrangement regions of each layer in a plane direction, an arrangement region of the scintillator layer is broader than the region opposed to a photoelectric conversion element, and an arrangement region of the adhesive layer is the same as or broader than the arrangement region of the photoelectric conversion element and at least a portion of the arrangement region of the adhesive layer is narrower than that of the scintillator layer.

TECHNICAL FIELD

The present invention relates to a radiation detecting apparatus and aradiation detecting system and, in particular, a radiation detectingapparatus and a radiation detecting system used for radiography and thelike.

BACKGROUND ART

Conventionally, a radiation detecting apparatus including a radiationfilm having a radiation intensifying screen and a photosensitive layerhaving a scintillator layer for converting X-rays into light has beengenerally used in radiographing.

However, there has been recently developed a digital radiation detectingapparatus having a scintillator having a scintillator layer and atwo-dimensional photo detector having a photoelectric conversionelement. In the digital radiation detecting apparatus, since dataobtained is digital data, image processing is easily performed.Accordingly, by incorporating such digital radiation detecting apparatusinto a networked computer system, the data can be shared. In addition,there is the following another advantage: storage of image digital datainto a magneto-photo disk or the like can decrease a storage space moreremarkably than storage of films, thus facilitating retrieval of pastimages. Further, as development of digital radiation detectingapparatuses have been advancing, such a digital radiation detectingapparatuses having characteristics of high sensitivity and highsharpness have been proposed, which has enabled reduction in patient'sradiation exposure doses.

As a conventional example of a digital radiation detecting apparatus,one example of a configuration is described in U.S. Pat. No. 5,856,699.U.S. Pat. No. 5,856,699 describes that a scintillator layer (wavelengthconversion member) for converting X-rays into visible light is disposedon an X-rays incidence side of a semiconductor element substrate havinga plurality of photoelectric conversion elements arranged in atwo-dimensional manner and a surface on the opposite side to the X-raysincidence side of the semiconductor element substrate is fixed on a basethrough adhesive agent.

In addition, Japanese Patent Application Laid-open No. 2005-214808describes such an example that a scintillator layer made of number ofcolumnar crystal made of CsI of Tl doped with high light-emittingefficiency are arranged on a surface on the X-rays incidence side of thephotoelectric conversion element substrate and the back face of thephotoelectric conversion element substrate is fixed on a mount substratewith adhesive agent. Further, the scintillator layer is covered withdamp-proof protective film.

DISCLOSURE OF THE INVENTION

However, conventional technologies described above cause the followingproblems: The protective film, the scintillator layer, the photoelectricconversion element substrate and the adhesive agent for joining the basehave different coefficients of thermal expansion from each other, sothat a stress is generated at each portion by surrounding environmenttemperature and heat generation inside an apparatus. Moreover, adifference between the stresses generates a force causing deformation ina protruding or recessing direction. Particularly, a large temperaturedifference between manufacturing processes for forming respectivemembers has already generated stresses under use environments ofapparatuses. In the conventional example, an existing stress is forciblycorrected by another member, and a force which attempts to return to adeformed condition where no correction is made is always applied.

Accordingly, peeling between joining surfaces of the scintillator layerand the photoelectric conversion element substrate having low adhesiveforce and breakage at the inside of the scintillator layer are apt tooccur. In particular, there is the high possibility of peeling orbreakage at a corner portion to which large stress is applied.

If peeling or breakage of the scintillator layer occurs, the lightgenerated at the inside of the scintillator layer is not exactlytransmitted, and a light intensity change or light scattering occurs,thus lowering light intensity and resolution.

In view of the foregoing problems, it is an object of the presentinvention to provide a radiation detecting apparatus capable of reducingpeeling between an array substrate and a scintillator layer, caused by adifference in coefficients of thermal expansion between members.

According to a first aspect of the present invention, a radiationdetecting apparatus comprises a laminating layered structure wherein asupporting substance, a first adhesive layer, an array substrate havinga photoelectric conversion element, a scintillator layer for convertinga radiation into light, a first resin layer are stacked in this order,wherein, in an arrangement region in a direction of a plane of each ofthe layers,

an arrangement region of the scintillator layer is broader than anarrangement region of the photoelectric conversion element,

an arrangement region of the first adhesive layer is the same as orbroader than an arrangement region of the photoelectric conversionelement, and has a portion narrower than the arrangement region of thescintillator layer, and

an arrangement region of the array substrate is broader than thearrangement region of the scintillator layer.

Furthermore, the present invention provides a radiation detecting systemcharacterized by including at least the radiation detecting apparatusdescribed above and a signal processing unit for processing a signalfrom the radiation detecting apparatus.

The present invention can reduce peeling of the scintillator layer ofthe radiation detecting apparatus and can prevent light intensitydegrading and resolution degrading.

Other features and advantages of the present invention will be apparentfrom the following description taken in conjunction with theaccompanying drawings, in which like reference characters designate thesame or similar parts throughout the figures thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of the specification, illustrate embodiments of the invention and,together with the description, serve to explain the principles of theinvention.

FIG. 1 is a simplified sectional view of a radiation detecting apparatusaccording to the present invention.

FIG. 2 is a simplified sectional view of a sheet-like bufferingsubstance according to the present invention.

FIG. 3 is a simplified sectional view of a radiation detecting apparatusfor description of positional relationships between respective membersaccording to the present invention.

FIG. 4 is a simplified sectional view of a radiation detecting apparatusaccording to the present invention when stress is applied.

FIG. 5 is a view illustrating the shape of a first adhesive layeraccording to the present invention.

FIG. 6 is a view illustrating another shape of a first adhesive layeraccording to the present invention.

FIG. 7 is a view illustrating another shape of a first adhesive layeraccording to the present invention.

FIG. 8 is a view illustrating another shape of a first adhesive layeraccording to the present invention.

FIG. 9 is a view illustrating another shape of a first adhesive layeraccording to the present invention.

FIG. 10 is a view illustrating another shape of a first adhesive layeraccording to the present invention.

FIG. 11 is a view illustrating another shape of a first adhesive layeraccording to the present invention.

FIG. 12 is a schematic view of a radiographic inspection systemaccording to the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Referring now to the accompanying drawings, description will be made ona radiation detecting apparatus and a radiation detecting systemaccording to the present invention and particularly, on one embodimentin a case where a radiation to be detected is X-ray. X-ray, α-ray, β-rayand γ-ray herein are included in radiation.

FIG. 1 is a sectional view of a radiation detecting apparatus accordingto one embodiment of the present invention. On an array substrate 10, aphotoelectric conversion element 11 for converting light into anelectric signal is disposed in a two-dimensional manner. On thephotoelectric conversion element 11, an insulation layer 12 is disposed.On the insulation layer 12, a scintillator layer 13 for converting X-rayinto visible light is disposed. Further, the following respective layersare layered adjacent to each other so as to cover the scintillator layer13. That is, a resin layer (polyolefine-group hot-melt resin layer asthermoplastic resin) 14, a metallic layer 15 as a electromagnetic shieldsubstance and a base 16 of the metallic layer 15 are laminated in order.The array substrate 10 and the supporting substance 20 are laminatedthrough a first adhesive layer 17.

In FIG. 1, the scintillator layer 13 is a layer of columnar crystalformed by vapor deposition of a substance having an activator added to amain ingredient on the insulation layer 12. That is, the scintillatorlayer 13 has a columnar crystal structure. As the main ingredient,cesium iodide (CsI) may be used. As the activator, thallium (Tl) may beused. In addition, the activator may use sodium (Na) as well. Formationof the scintillator layer 13 can be performed, for example, byconcurrently vapor depositing CsI of a main ingredient as an evaporatingsource and thallium iodide (TlI) of doping material. The vapordeposition is generally performed at a high temperature within the rangeof 100 to 300° C.

As the first resin layer 14, all that is needed is thermoplastic resin.Hot-melt resin is favorably used and polyolefine-group resin is used.The first resin layer 14 is not limited to polyolefine-group resin, anduse of hot-melt resin such as polyester-group, polyurethane-group andepoxy-group also provides the same advantage. The coefficient of thermalexpansion of the hot-melt resin varies with material type, for example,160 to 230×10⁻⁶/° C.

Further, the first adhesive layer 17 may use adhesive agent belonging tothe group of acryl-series, epoxy-series and silicon-series. Thecoefficient of thermal expansion of the adhesive agent varies withmaterial type, for example, 110×10⁻⁶/° C. or less.

Preferably, the material of the base 16 in FIG. 1 is polyethylene-groupresin such as polyethylene terephthalate (PET). However, the material isnot limited to the polyethylene-group resin, and other resins such asacrylic resin, phenol resin, polyvinyl chloride, polypropylene resin,polycarbonate resin and cellulose resin may be used.

In addition, for the metallic layer 15, aluminum is favorably used. Themetallic layer 15 is electromagnetic shielding and, if anelectromagnetic shielding effect exists, the material thereof is notlimited to aluminum and metal such as silver, silver alloy, copper andgold may be used. The metallic layer 15 also functions as a reflectivelayer of light from the scintillator layer 13.

A feature of the present invention is that there is a difference betweenarrangement regions of the scintillator layer 13 and the first adhesivelayer 17. Specifically, the arrangement region of the scintillator layeris broader than that of the photoelectric conversion element. Thearrangement region of the first adhesive layer is the same as or broaderthan that of the photoelectric conversion element and at least a portionof the arrangement region of the first adhesive layer is narrower thanthat of the scintillator layer. Now, detailed description will be madeon a feature portion thereof. The arrangement region used herein is aregion where each layer of the first adhesive layer 17, the scintillatorlayer 13 and the photoelectric conversion element 13 is projected on thesupporting substance 20.

Referring to FIG. 2 of a sectional view limited to members and aconfiguration thereof required to describe features of the presentinvention, detailed description will be made on the features below. FIG.2 illustrates an arrangement relationship of respective members based ona broken line H as the vertical center line of the radiation detectingapparatus in FIG. 1. Specifically, FIG. 2 illustrates an arrangementregion of each layer in a plane direction. Symbol A denotes anarrangement region of the photoelectric conversion element 11 from abroken line H. Symbol B denotes an arrangement region of the firstadhesive layer 17 from the broken line H. Similarly, symbol C denotes anarrangement of the scintillator layer 13 from the broken line H. SymbolD denotes an arrangement region of the array substrate 10 from thebroken line H.

In the present invention, at least a part of a first adhesive layerregion (B) disposed on the supporting substance 20 side of the arraysubstrate 10 is disposed at the same position as an outer peripheryportion of an arrangement region (A) of the photoelectric conversionelement 11 or more outward than the outer periphery portion of thearrangement region (A). Further, at least a part of an outer peripheryportion of an arrangement region (B) of the first adhesive layer 17 isdisposed more inward than an outer periphery portion of an arrangementregion (C) of the scintillator layer 13. The outer-periphery portion ofthe arrangement region (B) of the first adhesive layer 17 is disposedmore inward than an outer-periphery portion of an arrangement region (D)of the array substrate 10. Further, the outer-periphery portion of thearrangement region (C) of the scintillator layer 13 is disposed moreoutward than the outer-periphery of the arrangement region (A) of thephotoelectric conversion element 11 and is more inward than theouter-periphery portion of the arrangement region (D) of the arraysubstrate 10. Specifically, each of them has the following relationship:

A≦B<C<D  equation (1)

As seen from the above equation (1), distances from the center line H tothe outer-periphery portions of arrangement regions of respective layershave such a relationship that (B) is equal to or longer than (A), (C) islonger than (B) and (D) is longer than (C). To put it the other wayaround, there is such a relationship that (A) is equal to or shorterthan (B), (B) is shorter than (C) and (C) is shorter than (B).

Preferably, regions of at least a part of the first adhesive layer 17disposed on the supporting substance side of the array substrate 10satisfying the equation (1) are at least four corner portions of aradiation detection unit.

An arrangement of respective members satisfying conditions of theequation (1) provides the following effect even if stress occurs due toa change in use environment temperatures and each member changes into aprotrusion or recess shape. Specifically, in a more outward region thanthe arrangement region (B) of the adhesive layer 17 in which peeling orbreakage might begin to occur at the scintillator layer, the arraysubstrate 10 is not connected with the supporting substance 20.Accordingly, a member disposed above the array substrate 10 is notcorrected by the supporting substance 20 of a rigid body. Even if adifference exists between the coefficient of thermal expansion of thearray substrate 10 and those of the first resin layer 14, the metalliclayer 15 and the base 16, there is no influence of the supportingsubstance 20, which relieving an influence of stress applied to thescintillator layer. Accordingly, no peeling occurs between thescintillator layer 13 and the insulation layer 12 or no structuralbreakage occurs inside the scintillator layer 13.

FIG. 3 is a sectional view of an X-ray detecting apparatus according toanother embodiment of the present invention. The array substrate 10 istwo-dimensionally disposed with the photoelectric conversion element 11for converting light into an electric signal. Moreover, adjacent to thephotoelectric conversion element 11, there is disposed the insulationlayer 12. Moreover, adjacent to the insulation layer 12, there isdisposed the scintillator layer 13 for converting X-ray into visiblelight. Further, the following respective layers are layered in order,adjacent to thereof so as to cover the scintillator layer 13.Specifically, the first resin layer (polyolefine-group hot-melt resinlayer of thermoplastic resin) 14, the metallic layer 15 of anelectromagnetic shield substance and the base 16 of the metallic layer15 are layered in order. The array substrate 10 and the second resinlayer 18 having light shielding and buffering are provided, adjacent toeach other through the second adhesive layer 19. The resin layer 18 andthe supporting substance 20 are provided, adjacent to each other throughthe first adhesive layer 17. Wherein, an arrangement region of thesecond resin layer 18 and the second adhesive layer 19 is broader thanan arrangement region of the scintillator layer 13. And, shapes andsizes of the second resin layer 18 and the second adhesive layer 19 issimilar to a shape and a size of the array substrate 10.

In FIG. 3, the scintillator layer 13 is a layer of columnar crystalformed by vapor depositing a substance having an activator added to amain ingredient on the insulation layer 12. That is, the scintillatorlayer 13 has a columnar crystal structure. As the main ingredient,cesium iodide (CsI) may be used. As the activator, thallium (Tl) may beused. In addition, the activator may use sodium (Na) as well. Formationof the scintillator layer 13 can be performed, for example, byconcurrently vapor depositing CsI of a main ingredient as an evaporatingsource and thallium iodide (TlI) as doping material. The vapordeposition is generally performed at a high temperature within the rangeof 100 to 300° C.

As the first resin layer 14, all that is needed is thermoplastic resin.Hot-melt resin is favorably used and polyolefine-group resin is used.The first resin layer 14, in the case of hot-melt resin, is not limitedto polyolefine-group resin, and use of hot-melt resin such aspolyester-group, polyurethane-group and epoxy-group also provides thesame advantage. The coefficient of thermal expansion of the hot-meltresin varies with material type, for example, 160 to 230×10⁻⁶/° C.

The first adhesive layer and the second adhesive layer may use adhesiveagent belonging to any of acrylic-group, epoxy-group and silicon-group.The coefficient of thermal expansion of the adhesive agent varies withmaterial type, for example, 110×10⁻/° C. or less.

Preferably, the material of the base 16 in FIG. 1 is polyethylene-groupresin such as polyethylene terephthalate (PET). However, the material isnot limited to the polyethylene-group resin, and other resins such asacrylic resin, phenol resin, polyvinyl chloride, polypropylene resin,polycarbonate resin and cellulose resin may be used.

In addition, for the metallic layer 15, aluminum is favorably used. Themetallic layer 15 is electromagnetic shielding and, if anelectromagnetic shielding effect exists, the material thereof is notlimited to aluminum and metal such as silver, silver alloy, copper andgold may be used. The metallic layer 15 also functions as a reflectivelayer of light from the scintillator layer 13.

FIG. 4 illustrates a sheet-like buffering substance having the secondresin layer 18, the second adhesive layer 19 and the first adhesivelayer 17, where a separator is usually mounted on each adhesive layersurface for operation in an easy-to-handle shape. The second resin layerhas a buffering performance with a foaming structure and a lightshielding performance for absorbing the surplus light penetratingthrough the photoelectric conversion element array substrate 10 of thelight emitted by the scintillator layer 13. Thus, incidence of thereflective light from behind the photoelectric conversion element arraysubstrate 10 into the photoelectric conversion element 11 is suppressed.

A feature of the present embodiment is that there are differences inshape and size between the second adhesive layer 19 and the firstadhesive layer 17 in FIG. 4, thus describing a feature portion thereofin detail.

Referring to FIG. 5 of a sectional view limited to members and aconfiguration thereof required to describe features of the presentinvention, detailed description will be made on the features below. FIG.5 illustrates an arrangement relationship of respective members based ona broken line H as the vertical center line of the radiation detectingapparatus in FIG. 3. Specifically, FIG. 5 illustrates an arrangementregion of each layer in a plane direction. More specifically, it is mostpreferable that the broken line H is taken as the central portion of ascintillator layer. That is the reason why peeping-off or breakage at acorner portion of the scintillator layer is easy to be understood.Symbol A denotes an arrangement region of the photoelectric conversionelement 11 from a broken line H. Symbol B denotes an arrangement regionof the first adhesive layer 17 from the broken line H. Similarly, symbolC denotes an arrangement of the scintillator layer 13 from the brokenline H. Symbol D denotes an arrangement region of the second adhesivelayer 19 from the broken line H.

In the present invention, at least a part of an outer-periphery portionof an arrangement region (B) of the first adhesive layer 17 disposed onthe supporting substance side of the second resin layer 18 is disposedat a position equal to or more outward than an outer-periphery portionof an arrangement region (A) of the photoelectric conversion element 11.Further, at least a part of the outer periphery portion of thearrangement region (B) of the first adhesive layer 17 is disposed moreinward than an outer periphery portion of an arrangement region (C) ofthe scintillator layer 13. Further, the outer periphery portion of thearrangement region (B) of the first adhesive layer 17 is disposed moreinward than an outer periphery portion of an arrangement region (E) ofthe second adhesive layer 19 disposed on the photoelectric conversionelement array substrate 10 side of the second resin layer 18. Further,the outer-periphery portion of the arrangement region (C) of thescintillator layer 13 is disposed more outward than the arrangementregion (A) of the photoelectric conversion element 11 and is more inwardthan the outer-periphery portion of the arrangement region (E) of thesecond adhesive layer 19. Specifically, each of them has a relationshipof the following equation (2):

A≦B<C<E  equation (2)

However, regions of at least a part of the first adhesive layer 17disposed on the supporting substance side of the second resin layer 18satisfying the equation (2) are at least four corner portions of anX-ray detection unit.

FIG. 6 illustrates a state in which an apparatus in FIG. 3 has a warp.An arrangement of respective members satisfying conditions of theequation (2) provides the following effect even if stress occurs due toa change in use environment temperatures and each member changes into aprotrusion or recess shape. Specifically, in a more outward region thanthe arrangement region (B) of the adhesive layer 17 in which peeling orbreakage might begin to occur at the scintillator layer, the secondresin layer 18 is not connected with the supporting substance 20.Accordingly, a member disposed above the second resin layer 18 is notcorrected by the supporting substance 20 as a rigid body. Even if adifference exists between the coefficient of thermal expansion of thephotoelectric conversion element array substrate 10 and those of thefirst resin layer 14, the metallic layer 15 and the base 16, there is noinfluence of the supporting substance 20, which relieving an influenceof stress applied to the scintillator layer. Accordingly, no peelingoccurs between the scintillator layer 13 and the insulation layer 12 orno structural breakage occurs inside the scintillator layer 13.

The first adhesive layer 17 can have various types of shapes, providedthat the equation (2) is satisfied. Referring now to FIGS. 7 to 11,description will be made on embodiments thereof.

FIG. 7 illustrates a first adhesive layer 171, the array substrate 10,the photoelectric conversion element 11 disposed on the array substrate10 and the scintillator layer 13, when viewed from the supportingsubstance 20 side. The first adhesive layer 171 is disposed in the samerectangular shape as the array substrate 10, within a region of therectangular array substrate 10. An arrangement region of the firstadhesive layer 171 used herein is a region satisfying the equation (1).The array substrate 10 may be considered by replacement with the secondresin layer. In this case as well, the arrangement region of the firstadhesive layer 171 is a region satisfying the equation (2).

FIG. 8 illustrates another embodiment of the present invention. In thisexample, the first adhesive layer 172 has a shape obtained by linearlycutting each of four corner portions from the same rectangular shape asin FIG. 7. Thus, flexibility to stress increases by an amountcorresponding to no adhesive layer arrangement at four corner portions,thus further suppressing an adverse effect upon the scintillator layer.

FIG. 9 illustrates further another embodiment. In this example, anadhesive layer 173 has such a shape that only four corner portions arelinearly cut-off from the whole surface of the resin layer 18 in arectangular region, respectively. In this case, only the four cornerportions in a cut-off region satisfy the equation (1). Stress becomesmaximum in a diagonal direction. Accordingly, to a cut end portion withlittle stress, the resin layer 18 is connected using adhesive agent,which enables reinforcement against an external force from the top ofthe X-ray detecting apparatus and high quality at the corner portions.

FIGS. 10 and 11 illustrate further another embodiments. An adhesivelayer 174 in FIG. 10 has such a circular shape as to satisfy theequation (1) only at the four corner portions of the array substrate 10.Specifically, the adhesive layer has a circular shape inscribing theresin layer 18 of a rectangular shape. On the other hand, an adhesivelayer 175 in FIG. 11 has a circular shape more inward than a region ofthe rectangular array substrate 10. Accordingly, the adhesive layer 175satisfies the equation (1) at the four corner portions of the arraysubstrate 10 as well as other regions. Both embodiments provide the sameeffect as the embodiment described above.

In FIGS. 8 to 11, in the case of an apparatus configuration in FIG. 3,the resin layer 18 is disposed in a region equivalent to the arraysubstrate 10.

In the present invention, the scintillator layer 13 is not alwaysapplied to only the scintillator having a columnar crystal structureformed by vapor depositing CsI added with Tl on the insulation layer 12.In addition, a scintillator formed by compressing grain such as GOS withbinder may be stuck to the insulation layer 12 together using adhesiveagent or the like. In that case, adhesiveness between connectionportions of the scintillator layer 13 and the insulation layer 12, oradhesiveness between particles in the scintillator layer is apt to causeproblems such as an adverse effect of stress, peeling and cohesivefailure in the radiation detecting apparatus. However, adoption of thepresent invention can suppress the adverse effect of stress, thussolving problems such as peeling and cohesive failure of thescintillator layer.

Applied Example

Referring next to FIG. 12, description will be made on an appliedexample where the radiation detecting apparatus according to theembodiment of the present invention is applied to a radiation detectingsystem as an image diagnostic system.

The radiation 1002 generated at a radiation tube (radiation source) 1001passes through a portion 1004 of the body, such as the chest of a personto be inspected 1003 like a patient and enters a radiation imagingapparatus 1100 with a scintillator mounted on the top thereof. Theincident radiation 1002 includes information of the internal body of theperson to be inspected 1003. In the radiation imaging apparatus 1100,the scintillator illuminates in response to the incidence of radiation1002, which is subjected to photoelectric conversion to obtainelectrical information. In addition, the radiation imaging apparatus1100 may convert radiation 1002 directly into charges to obtainelectrical information. The electrical information is converted intodigital (signal), subjected to image processing by an image processor1005 as a signal processing unit and displayed on a display 1006 as adisplay unit in a control room.

In addition, the electrical information can be transferred to a distantplace through a transmission unit 1007 such as radio transmission orwire transmission such as telephone line. Accordingly, the informationcan be displayed on a display 1008 as a display unit installed at adoctor room or the like provided in a separate place, or can be storedin a recording medium such as optical disk by a film processor 1009 as arecording unit. This permits a doctor at a distant place to diagnose apatient. The film processor 1009, connected with a laser printer as aprinting unit, can record information transmitted by the transmissionunit 1007 in a recording medium such as film.

As many apparently widely different embodiments of the present inventioncan be made without departing from the spirit and scope thereof, it isto be understood that the invention is not limited to the specificembodiments thereof except as defined in the claims.

This application claims the benefit of Japanese Patent Application Nos.2007-109469, filed Apr. 18, 2007, and 2008-083387, filed Mar. 27, 2008which are hereby incorporated by reference herein in their entirety.

1. A radiation detecting apparatus comprising a laminating layeredstructure wherein a supporting substance, a first adhesive layer, anarray substrate having a photoelectric conversion element, ascintillator layer for converting a radiation into light, a first resinlayer are stacked in this order, wherein, in an arrangement region in adirection of a plane of each of the layers, an arrangement region of thescintillator layer is disposed outward relative to an arrangement regionof the photoelectric conversion element, an arrangement region of thefirst adhesive layer is disposed the same as or outward relative to anarrangement region of the photoelectric conversion element, and has aportion disposed inward relative to the arrangement region of thescintillator layer, and an arrangement region of the array substrate isdisposed outward relative to the arrangement region of the scintillatorlayer.
 2. The radiation detecting apparatus according to claim 1,wherein the arrangement region of the scintillator layer has arectangular shape, the portion of the arrangement region of firstadhesive layer disposed inward relative to the arrangement region of thescintillator layer is a corner portion of the scintillator layer.
 3. Theradiation detecting apparatus according to claim 1, wherein the arraysubstrate and the scintillator layer have a rectangular shape, and thefirst adhesive layer is arranged at an area inside of the scintillatorlayer in an arrangement configuration of a rectangular shape like thescintillator layer.
 4. The radiation detecting apparatus according toclaim 1, wherein the array substrate and the scintillator layer has arectangular shape, the first adhesive layer is arranged inside of thescintillator layer to have a shape of a rectangle of which four cornerareas are respectively cut linearly.
 5. The radiation detectingapparatus according to claim 2, wherein the array substrate has arectangular shape, and the first adhesive layer is arranged to have ashape of which four corner areas corresponding to the whole rectangularshape of the array substrate are respectively cut linearly.
 6. Theradiation detecting apparatus according to claim 2, wherein the arraysubstrate has a rectangular shape, and the first adhesive layer isarranged to have a circular shape inscribing the array substrate of therectangular shape.
 7. The radiation detecting apparatus according toclaim 3, wherein the array substrate and the scintillator layer have arectangular shape, and the first adhesive layer is arranged to have acircular shape inside of the edge of the scintillator layer of therectangular shape.
 8. The radiation detecting apparatus according toclaim 1, further comprising a second resin layer arranged between thefirst adhesive layer and the array substrate, and a second adhesivelayer arranged between the second adhesive layer and the arraysubstrate, wherein an arrangement region of the second resin layer andthe second adhesive layer is disposed outward relative to thearrangement region of the scintillator layer.
 9. The radiation detectingapparatus according to claim 8, wherein the arrangement region of thescintillator layer has a rectangular shape, and the portion of thearrangement region of the first adhesive layer disposed inward relativeto the arrangement region of the scintillator layer is a corner portionof the scintillator layer.
 10. The radiation detecting apparatusaccording to claim 8, wherein the second resin layer and thescintillator layer have a rectangular shape, and the first adhesivelayer is arranged at an inside area of the second resin layer in anarrangement configuration of a rectangular shape like the second resinlayer.
 11. The radiation detecting apparatus according to claim 8,wherein the second resin layer and the scintillator layer have arectangular shape, and the first adhesive layer is arranged at an insidearea of the second resin layer to have a shape of a rectangle of whichfour corner areas are respectively cut linearly.
 12. The radiationdetecting apparatus according to claim 9, wherein the second resin layerand the scintillator layer have a rectangular shape, and the firstadhesive layer is arranged to have a shape of which four corner areascorresponding to the whole rectangular shape of the second resin layerare respectively cut linearly.
 13. The radiation detecting apparatusaccording to claim 9, wherein the second resin layer and thescintillator layer have a rectangular shape, and the first adhesivelayer is arranged to have a circular shape in which the second resinlayer of the rectangular shape is inscribed.
 14. The radiation detectingapparatus according to claim 8, wherein the second resin layer and thescintillator layer have a rectangular shape, and the first adhesivelayer is arranged to have a circular shape inside of the second resinlayer of the rectangular shape.
 15. The radiation detecting apparatusaccording to claim 8, wherein the first and second adhesive layers areformed from a material selected from an acryl series, an epoxy series ora silicone series group.
 16. The radiation detecting apparatus accordingto claim 1, wherein the scintillator layer has a structure wherein anactivator is added to a main ingredient.
 17. The radiation detectingapparatus according to claim 5, wherein the scintillator layer has acolumnar crystal structure.
 18. The radiation detecting apparatusaccording to claim 16, wherein the main ingredient is cesium iodide. 19.The radiation detecting apparatus according to claim 16, wherein theactivator is thallium.
 20. The radiation detecting apparatus accordingto claim 8, wherein the second resin layer has a light shieldingperformance.
 21. The radiation detecting apparatus according to claim 8,wherein the second resin layer has a buffering performance.
 22. Aradiation detecting system comprising: a radiation detecting apparatusaccording to claim 1; and a signal processing unit for processing asignal from the radiation detecting apparatus.